FR4 Matt ʻEleʻele Hogogen-Free Glassfiber Laminated Haumana
Hōʻike Huahana
Ua lamineka ʻia kēia huahana e ke ana wela kiʻekiʻe a me ke kiʻekiʻe me ka lole aniani uila uila i hoʻouluulu ʻia me ka resin epoxy halogen-free. Me nā ʻenehana mechanical kiʻekiʻe, nā waiwai dielectric a me nā pono retardant o ke ahi, ʻo ia pū kekahi me ke kūpaʻa wela maikaʻi a me ka ʻaʻa kūpale.
Hoʻohuli me nā Kūlana
I kulike ai me GB / T 1303.4-2009 uila thermosetting kēpau hanalima laminates paakiki - Mahele 4: epoxy kēpau paakiki laminates, IEC 60893-3-2-2011 insulate mea - uila thermosetting kēpau hanalima paʻakikī laminates - Mahele 3-2 o kēlā me kēia mea. hoakaka EPGC202.
Hiʻona
1.High mechanical pono;
2. Nā waiwai dielectric kiʻekiʻe;
3.Mecinability maikaʻi
4. ʻO ke kūpale maikaʻi o ka wai;
5. ʻO ke kūpaʻa wela maikaʻi;
6. ʻOhana kūpale: Papa B, 130℃
7. ʻO ka waiwai pale retame: UL94 V-0
Palapala noi
Hoʻohana nui ʻia kēia huahana e like me nā ʻāpana o ka motika a me nā pono uila, e like me nā ʻano kuapo, nā pono uila, ka pā ikaika FPC, nā papa kaʻa uila i paʻi ʻia, nā papa hana ʻeli a me nā mea hoʻoheheʻe (PCB hōʻike ahi）; a pēlā pū kekahi. kūpono ma lalo o ka pulu a me ka aila hoʻololi.
Papa Kuhikuhi Hana Nui
| AʻOLE. | NA MEA | UNIT | WAIWAI HIKI | |
| 01 | Ka mānoanoa | Bi / cm³ | 1.8-2.0 | |
| 02 | Ka omo wai | % | <0.5 | |
| 03 | Ikaika kūlou kū | MPa | ≥350 | |
| 04 | Ka ikaika o ka hopena like, ʻĀina Charpy） | KJ / m² | ≥33 | |
| 05 | ʻO ka ikaika o ka shear like | MPa | ≥30 | |
| 06 | Ka ikaika ikaika | MPa | ≥240 | |
| 07 | Ikaika uila uila （i ka aila o 90 ℃ ± 2 ℃） | 1mm | MV / m | ≥14.2 |
| 2mm | ||||
| ≥11.8 | ||||
| 3mm | ||||
| ≥10.2 | ||||
| 08 | Pākuʻi haʻihaʻi like （i ka aila o 90 ℃ ± 2 ℃） | KV | ≥35 | |
| 09 | Palena dielectric pili （50Hz) | - | ≤5.5 | |
| 10 | Dielectric dissipation ololi （50Hz) | - | ≤0.04 | |
| 11 | ʻO ke kūpale pale ma hope o ka pulu ʻana aking Ma hope o ka pulu ʻana no 24 mau hola | M | ≥5.0 × 104 | |
| 12 | Kūʻē ahi （UL94) | - | V-0 | |
