EPGC308 Epoxy Fiberglass Laminated Pepa (G11-H)
Aʻo Huahana
ʻO nā mea EPGC308 ka lāʻau lapaʻau kemika i hoʻohana ʻia i ka alkali-free fiberglass reinforced laminates, i hoʻopaʻa ʻia me ka resin epoxy TG kiʻekiʻe. Loaʻa ka ikaika mechanical kiʻekiʻe ma lalo o ka mahana maʻamau, aia nō ka ikaika mechanical ikaika, nā waiwai uila maikaʻi ma lalo o kahi maloʻo a me ka pulu, hiki ke hoʻohana ʻia i loko. kaiapuni pulu a me ka aila transformer.No ka papa H ka wela pale insulating mea.
Hoʻokō me nā kūlana
E like me GB/T 1303.4-2009 uila thermosetting resin industrial hard laminates - Māhele 4: epoxy resin hard laminates, IEC 60893-3-2-2011 insulating mea - uila thermosetting resin industrial hard laminates - Māhele 3-2 o kēlā me kēia mea. kikoʻī EPGC308.
Palapala noi
He kūpono no ka papa 180 (H) kaʻa kaʻa, nā kaʻa nui e like me nā ʻāpana slot a me nā mea uila kiʻekiʻe e like me nā hopena insulation pale wela,
Nā kiʻi huahana
Ka lā ʻenehana nui (Kaomi ma aneʻi e hoʻoiho i ka hōʻike hōʻike hoʻāʻo ʻekolu)
| 'ikamu | Waiwai | Unite | Waiwai maʻamau | Waiwai maʻamau | ʻAno hoʻāʻo |
| 1 | ʻO ka ikaika hoʻololi e pili ana i nā laminations (MD, 23 ℃ ± 2 ℃) | MPa | ≥380 | 556 | GB/T 1303.2 |
| 2 | ʻO ka ikaika flexural perpendicular to laminations (MD,180 ℃ ± 2 ℃) | MPa | ≥190 | 298 | |
| 3 | ʻO ka ikaika hoʻololi e pili ana i nā laminations (MD, 23 ℃ ± 2 ℃) | MPa | _ | 24252 | |
| 4 | ʻO ka ikaika hopena Charpy e like me nā laminations (Notched, MD) | kJ/m2 | ≥37 | 111 | |
| 5 | Ka ikaika uʻi (MD) | MPa | ≥300 | 557 | |
| 6 | Ka ikaika compressive e pili ana i nā laminations (23 ℃ ± 2 ℃) | MPa | ≥380 | 640 | |
| 7 | Ka ikaika compressive e pili ana i nā laminations (180 ℃ ± 2 ℃) | MPa | ≥190 | 378 | |
| 8 | ʻO ka ikaika uila e kū pono ana i nā laminations (ma 90 ℃ ± 2 ℃ i ka ʻaila transformer 25 #, 20s hoʻāʻo i kēlā me kēia ʻanuʻu, Φ25mm/Φ75mm cylindrical electrode) | kV/mm | ≥14.2 | 19.2 | |
| 9 | Hoʻokaʻawale ka uila e like me nā laminations (ma 90 ℃ ± 2 ℃ i ka ʻaila transformer 25 #, 20 mau hoʻāʻo i kēlā me kēia ʻanuʻu, Φ130mm/Φ130mm plate electrode) | kV | ≥45 | >100 | |
| 10 | ʻAe ʻia (1MHz) | _ | ≤5.5 | 5.20 | |
| 11 | Mea hoʻoheheʻe dielectric (1MHz) | _ | ≤0.04 | 0.0102 | |
| 12 | ʻO ke kūpaʻa ʻana ma hope o ka hoʻoinu ʻana i ka wai (MD, taper pin electrodes, 25.0mm gap) | Ω | ≥5.0 x1010 | 2.6x1014 | |
| 13 | Ka hoʻoheheʻe wai | mg | ≤22 | 18.00 | |
| 14 | ʻO ka mānoanoa | g/cm3 | 1.7-2.0 | 1.98 | |
| 15 | Helu helu wela | ℃ | _ | 180 ℃ | |
| 16 | TG | ℃ | _ | 200℃±5℃ |
FAQ
Q1: He hui kālepa a mea hana paha ʻoe?
ʻO mākou ka mea hana nui o ka uila insulating composite, Ua hana mākou i ka mea hana thermoset rigid composite mai ka makahiki 2003. ʻO kā mākou mana he 6000TONS / makahiki.
Q2: Nā laʻana
He manuahi nā laʻana, pono ʻoe e uku no ka uku hoʻouna.
Q3: Pehea ʻoe e hōʻoiaʻiʻo ai i ka maikaʻi o ka hana nui?
No ka hiʻohiʻona, ka nui a me ka mānoanoa: e hana mākou i ka nānā piha ma mua o ka hoʻopili ʻana.
No ka maikaʻi o ka hana: Hoʻohana mākou i kahi ʻano paʻa, a e nānā mau ʻia, hiki iā mākou ke hāʻawi i ka hōʻike ʻike huahana ma mua o ka hoʻouna ʻana.
Q4: Ka manawa hoʻouna
Ma muli o ka nui o ke kauoha. ʻO ka'ōlelo maʻamau,ʻo 15-20 mau lā ka manawa hāʻawi.
Q5: Pūʻolo
E hoʻohana mākou i ka pepa hana ʻoihana e hoʻopaʻa i ka pallet plywood.inā loaʻa iā ʻoe nā koi kūikawā, e hoʻopili mākou e like me kou pono.
Q6: Uku
TT, 30% T / T ma mua, kaulike ma mua o ka hoʻouna ʻana, ʻae pū mākou iā L / C.