ʻO ka hale hana Kina Epoxy Resin Fiberglass Sheet G11 Sheet me ka CNC Service
Hōʻike huahana
He huahana laminated kēia huahana i hana ʻia me ka lole aniani alkali-free i hana ʻia me ka lole aniani alkali-free e like me ka mea kākoʻo, ma ke kaomi wela me ka epoxy resin ma ke ʻano he binder. ʻO ka thermostability ka papa F, kūpono no nā ʻano kaʻa āpau, nā mea uila, uila a me nā ʻano ʻē aʻe.
Nā hiʻohiʻona
1.Good uila paʻa ma lalo kiʻekiʻe humidity;
2.High mechanical ikaika ma lalo o ke kiʻekiʻe wela;
3.Moisture kū'ē;
4.Heat kū'ē;
5. Ke kū'ē i ka mahana: Grade F
Hoʻokō me nā Kūlana
E like me GB/T 1303.4-2009 uila thermosetting resin laminates paʻakikī - Māhele 4: epoxy resin hard laminates.
ʻO ka hiʻohiʻona: pono e palahalaha ka ʻili, me ka ʻole o nā ʻōpū, nā lua a me nā wrinkles, akā ʻae ʻia nā hemahema ʻē aʻe i pili ʻole i ka hoʻohana ʻana, e like me: scratches, indentation, stains a me kekahi mau kiko. ʻAʻole e hoʻokaʻawale ʻia ka maka hope a nahā.
Palapala noi
He kūpono no nā ʻano kaʻa like ʻole, nā mea uila, uila a me nā kahua ʻē aʻe.
Papa kuhikuhi hana nui
| ʻAʻOLE. | MEA | UNIT | KA WAIWAI INDEX | ||
| 1 | ʻO ka mānoanoa | g/cm³ | 1.8-2.0 | ||
| 2 | Ka nui o ka hoʻoheheʻe wai | % | ≤0.5 | ||
| 3 | ʻO ka ikaika kūlou pololei | Maʻamau | MPa | ≥340 | |
| 155±2 ℃ | ≥170 | ||||
| 4 | Ka ikaika hoʻoemi | Kū pololei | MPa | ≥300 | |
| Kaulike | ≥200 | ||||
| 5 | Ka ikaika o ka hopena (charpy type-gap) | ʻAʻohe puka ka lōʻihi | KJ/m² | ≥147 | |
| Horizontal ʻaʻohe puka | ≥98 | ||||
| 6 | Ka ikaika pili | N | ≥6800 | ||
| 7 | Ka ikaika tensile | Ka lōʻihi | MPa | ≥280 | |
| Kaupae | ≥200 | ||||
| 8 | Ka ikaika uila kū pololei （i loko o ka aila o 90 ℃ ± 2 ℃） | 1mm | KV/mm | ≥14.2 | |
| 2mm | ≥11.8 | ||||
| 3mm | ≥10.2 | ||||
| 9 | ʻO ka uila hoʻohaʻahaʻa like (1 min i ka aila o 90 ℃ ± 2 ℃） | KV | ≥35 | ||
| 10 | Dielectric dissiption factor (50Hz) | - | ≤0.04 | ||
| 11 | Kū'ē Kū'ē Parallel | Maʻamau | Ω | ≥1.0×1012 | |
| Ma hope o ka hoʻoulu ʻana no 24 mau hola | ≥1.0×1010 | ||||
